high7.8
CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM…
Impact
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Affected products
| Vendor | Product | Affected versions |
|---|---|---|
| Qualcomm | Mdm9206 Firmware | All versions |
| Qualcomm | Mdm9607 Firmware | All versions |
| Qualcomm | Mdm9650 Firmware | All versions |
| Qualcomm | Msm8909w Firmware | All versions |
| Qualcomm | Msm8996au Firmware | All versions |
| Qualcomm | Sd 210 Firmware | All versions |
| Qualcomm | Sd 212 Firmware | All versions |
| Qualcomm | Sd 205 Firmware | All versions |
| Qualcomm | Sd 425 Firmware | All versions |
| Qualcomm | Sd 450 Firmware | All versions |
| Qualcomm | Sd 615 Firmware | All versions |
| Qualcomm | Sd 616 Firmware | All versions |