high7.8
CVE-2017-18297
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Impact
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Affected products
| Vendor | Product | Affected versions |
|---|---|---|
| Qualcomm | Sd 425 Firmware | All versions |
| Qualcomm | Sd 430 Firmware | All versions |
| Qualcomm | Sd 450 Firmware | All versions |
| Qualcomm | Sd 625 Firmware | All versions |
| Qualcomm | Sd 650 Firmware | All versions |
| Qualcomm | Sd 652 Firmware | All versions |
| Qualcomm | Sd 820 Firmware | All versions |
Weakness classification
References
- NVD record
- CVE.org record
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
- https://www.qualcomm.com/company/product-security/bulletins
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
- https://www.qualcomm.com/company/product-security/bulletins