CVE-2017-18323

Impact

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

Affected products

Weakness classification

References

• NVD record
• CVE.org record
• http://www.securityfocus.com/bid/106128
• https://www.qualcomm.com/company/product-security/bulletins
• http://www.securityfocus.com/bid/106128
• https://www.qualcomm.com/company/product-security/bulletins