CVE-2018-11267

Impact

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.

Affected products

Weakness classification

References

• NVD record
• CVE.org record
• http://www.securityfocus.com/bid/106128
• https://www.qualcomm.com/company/product-security/bulletins
• http://www.securityfocus.com/bid/106128
• https://www.qualcomm.com/company/product-security/bulletins