CVE-2018-13888

Impact

There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.

Affected products

Weakness classification

References

• NVD record
• CVE.org record
• http://www.securityfocus.com/bid/106475
• https://www.qualcomm.com/company/product-security/bulletins
• http://www.securityfocus.com/bid/106475
• https://www.qualcomm.com/company/product-security/bulletins