high7.8
CVE-2019-14037
Close and bind operations done on a socket can lead to a Use-After-Free condition.
Impact
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Affected products
| Vendor | Product | Affected versions |
|---|---|---|
| Qualcomm | Apq8009 Firmware | All versions |
| Qualcomm | Apq8053 Firmware | All versions |
| Qualcomm | Apq8096au Firmware | All versions |
| Qualcomm | Apq8098 Firmware | All versions |
| Qualcomm | Mdm9206 Firmware | All versions |
| Qualcomm | Mdm9207c Firmware | All versions |
| Qualcomm | Mdm9607 Firmware | All versions |
| Qualcomm | Mdm9640 Firmware | All versions |
| Qualcomm | Mdm9650 Firmware | All versions |
| Qualcomm | Msm8905 Firmware | All versions |
| Qualcomm | Msm8909w Firmware | All versions |
| Qualcomm | Msm8996 Firmware | All versions |